TB6674FAG データシートの表示（PDF） - Toshiba

部品番号

コンポーネント説明

メーカー

TB6674FAG

BiCD Integrated Circuit Silicon Monolithic

Toshiba 

TB6674PG/FG/FAG

Points to remember on handling of ICs

(1) Heat Radiation Design

In using an IC with large current flow such as power amp, regulator or driver, please design the

device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at

any time and condition. These ICs generate heat even during normal use. An inadequate IC heat

radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown.

In addition, please design the device taking into considerate the effect of IC heat radiation with

peripheral components.

(2) Back-EMF

When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to

the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power

supply is small, the device’s motor power supply and output terminals might be exposed to

conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF

into consideration in system design.

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2010-08-25

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