TC72 データシートの表示（PDF） - Microchip Technology

部品番号

コンポーネント説明

メーカー

TC72

Digital Temperature Sensor with SPI™ Interface

Microchip Technology 

TC72

8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN)

X

Z G CP

p

Y

G2

H

DFN LAND PATTERN

H2

P1

THERMAL VIAS

ON 4 LAYER

PC BOARD

0V

OPTIONAL FOUR LAYER

PCB LAND PATTERN

OPTIONAL TWO LAYER

PCB LAND PATTERN

M (TYP)

Units

Terminal Pitch

Dimension Limits

MIN

p

Terminal Land Pattern O.D.

Z

.134

Terminal Land Pattern I.D.

A1

.057

Exposed Pad Clearance

CP

.006

Interior Lead Clearance

Z

.071

Terminal Land Width

X

.014

Terminal Land Length

Y

.033

Exposed Pad Length

H

.130

Optional Exposed Pad Length

H2

.130

Exposed Pad Width (Note 1)

G2

.057

Termal Via Pitch

P1

Thermal Via Diameter

V

Minimum Solder Mask Clearance

M

.002

*Controlling Parameter

Notes:

1. Exposed pad dimensions vary with paddle size.

Drawing No. C04-2062

INCHES

NOM

.026 BSC

.047

.012

TYPCAL SOLDER MASKS

MAX

.157

.060

.017

.035

.059

MILLIMETERS*

MIN

NOM

0.65 BSC

3.40

1.45

0.15

1.80

0.35

0.85

3.30

3.30

1.45

1.20

0.30

0.05

MAX

4.00

1.53

0.42

0.88

1.50

DS21743A-page 18

 2002 Microchip Technology Inc.

Share Link: