TDA7267T データシートの表示（PDF） - STMicroelectronics
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TDA7267T Datasheet PDF : 10 Pages
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Applications information
4
Applications information
TDA7267T
For 12-V supply and 8-Ω speaker applications the maximum power dissipation is
approximately 1.2 W.
Assuming that the maximum ambient temperature is 70° C the required thermal resistance
of the devices must be equal to (150 - 70) / 1.2 = 67 °C/W.
The junction-to-pin thermal resistance of the package is about 23 °C/W. This means that an
external heatsink of around 43 °C/W is required.
The copper ground plane of the PCB can be used for dissipating this heat.
Standby switches must be able to discharge the CSVR current.
t(s) - Obsolete Product(s) Figure 3.
Thermal resistance junction-to-ambient vs copper area on PCB
80.00
78.00
76.00
74.00
72.00
70.00
68.00
66.00
64.00
62.00
60.00
0
0.5
1
1.5
2
2.5
3
3.5
4
Cu Area on PCB (cm2)
Obsolete Produc Figure 4.
Power derating curve
2.20
2.00
1.80
1.60
1.40
1.20
1.00
Copper Area 3 Cm2
0.80
0.60 NO Copper Area (others than tracks)
0.40
0.20
0.00
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160
Tambient (oC)
6/10
Doc ID 15776 Rev 2
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