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TDA8004 データシートの表示(PDF) - Philips Electronics

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TDA8004
Philips
Philips Electronics Philips
TDA8004 Datasheet PDF : 24 Pages
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Philips Semiconductors
IC card interface
Product specification
TDA8004T
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); notes 1 and 2.
SYMBOL
PARAMETER
VDD, VDDP
Vn1
supply voltage
voltage on pins: XTAL1, XTAL2, RFU1, RSTIN,
AUX2UC, AUX1UC, I/OUC, CLKDIV1, CLKDIV2,
CMDVCC and OFF
Vn2
voltage on card contact pins PRES, PRES, I/O, RST,
AUX1, AUX2 and CLK
Vn3
voltage on pin VUP, S1 and S2
Tstg
IC storage temperature
Ptot
continuous total power dissipation
Tj
junction temperature
Ves1
electrostatic voltage on pins: I/O, RST, VCC, AUX1,
CLK, AUX2, PRES and PRES
Ves2
electrostatic voltage on all other pins
CONDITIONS
MIN.
0.3
0.3
MAX. UNIT
+7
V
+7
V
0.3 +7
V
55
Tamb = 25 to +85 °C
6
9
V
+125 °C
0.56 W
150 °C
+6
kV
2
+2
kV
Notes
1. All card contacts are protected against any short with any other card contact.
2. Stress beyond these levels may cause permanent damage to the device. This is a stress rating only and functional
operation of the device under this condition is not implied.
HANDLING
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM; 1500 ; 100 pF) 3 pulses positive and 3 pulses negative on each pin referenced to ground.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth(j-a)
thermal resistance from junction to ambient
CONDITIONS
in free air
VALUE
70
UNIT
K/W
1999 Dec 30
12

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