TDF5140A データシートの表示（PDF） - Philips Electronics

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TDF5140A

Brushless DC motor drive circuit

Philips Electronics 

Philips Semiconductors

Brushless DC motor drive circuit

Product specification

TDF5140A

SOLDERING

Plastic dual in-line packages

BY DIP OR WAVE

The maximum permissible temperature of the solder is 260 °C; this temperature must not be in contact with the joint for

more than 5 s. The total contact time of successive solder waves must not exceed 5 s.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the

specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary

immediately after soldering to keep the temperature within the permissible limit.

REPAIRING SOLDERED JOINTS

Apply the soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 °C, it

must not be in contact for more than 10 s; if between 300 and 400 °C, for not more than 5 s.

1999 March 15

18

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