TJA1041A データシートの表示（PDF） - Philips Electronics

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TJA1041A

High speed CAN transceiver

Philips Electronics 

Philips Semiconductors

High speed CAN transceiver

Product specification

TJA1041A

handbook, full pagewidth

TXD

HIGH

LOW

CANH

CANL

Vi(dif)(bus)(1)

RXD

t d(TXD-BUSon)

t d(BUSon-RXD)

0.3VCC

(1) Vi(dif)(bus) = VCANH − VCANL.

t PD(TXD-RXD)

0.9 V

dominant

(BUS on)

0.5 V

recessive

(BUS off)

HIGH

0.7VCC

LOW

t d(TXD-BUSoff)

t d(BUSoff-RXD)

t PD(TXD-RXD)

MGS377

Fig.9 Timing diagram.

BONDING PAD LOCATIONS

SYMBOL

TXD

GND

VCC

RXD

VI/O

EN

INH

ERR

WAKE

VBAT

SPLIT

CANL

CANH

STB

PAD

1

2

3

4

5

6

7

8

9

10

11

12

13

14

COORDINATES(1)

x

y

664.25

75.75

115.5

115.5

115.5

264.5

667.75

1 076.75

1 765

1 765

1 765

1 765

1 751

940.75

3 004.5

3 044.25

2 573

1 862.75

115.5

114

85

115.5

85

792.5

1 442.25

2 115

3 002.5

3 004.5

Note

1. All x/y coordinates represent the position of the centre

of each pad (in µm) with respect to the left hand bottom

corner of the top aluminium layer.

handbook, halfpage

2

3

4

1 14

13

12

TJA1041AU

11

10

x5

0

67

8

0

y

9

MDB634

The reverse side of the bare die must be connected to ground.

Fig.10 Bonding pad locations.

2004 Feb 20

18

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