TJA1051T-E データシートの表示（PDF） - Philips Electronics

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TJA1051T-E

High-speed CAN transceiver

Philips Electronics 

NXP Semiconductors

TJA1051

High-speed CAN transceiver

temperature

maximum peak temperature

= MSL limit, damage level

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 9. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

17. Soldering of HVSON packages

Section 16 contains a brief introduction to the techniques most commonly used to solder

Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON

leadless package ICs can found in the following application notes:

• AN10365 ‘Surface mount reflow soldering description”

• AN10366 “HVQFN application information”

TJA1051

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 6 — 25 March 2011

© NXP B.V. 2011. All rights reserved.

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