TPS850 データシートの表示（PDF） - Toshiba
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TPS850 Datasheet PDF : 10 Pages
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TPS850
Handling Precautions
At power-on in darkness, the internal circuit takes about 50 ms to stabilize. During this period the output signal
is unstable and may change. Please take this into account.
Moisture-Proof Packing
(1) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica
gel.
(2) Since the optical characteristics of the device can be affected during soldering by vaporization
resulting from prior absorption of moisture and they should therefore be stored under the following
conditions:
Temperature: 5°C to 30°C, Relative humidity: 60% (max), Time: 168 h
(3) Baking is required if the devices have been store unopened for more than six months or if the
aluminum envelope has been opened for more than 168 h.
These devices are packed on tapes; hence, please avoid baking at high temperature.
Recommended baking conditions: 60°C for 12 h or longer
Mounting Precautions
(1) Do not apply stress to the resin at high temperature.
(2) The resin part is easily scratched, so avoid friction with hard materials.
(3) When installing the assembly board in equipment, ensure that this product does not come into
contact with other components.
Mounting Methods
(1) Reflow soldering
• Package surface temperature: 260°C (max)
• Please perform reflow soldering using the following reference temperature profile.
Perform reflow soldering no more than twice.
190°C
180°C
Preheating part
60 s to 120 s
260°C max
230°C
30 s to 50 s Heating part
Time (s) →
• Please perform the first reflow soldering within 168 h after opening the package with reference to
the above temperature profile.
• Second reflow soldering
In case of second reflow soldering, it should be performed within 168 h after first reflow under the
above conditions.
Storage conditions before second reflow soldering: 30°C, 60% RH or lower
• Do not perform flow soldering.
• Make any necessary soldering correction manually.
(do not do this more than once for any given pin.)
Temperature: no more than 350°C (25 W for soldering iron)
Time: within 5 s
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2007-10-01
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