TPS851(2002) データシートの表示（PDF） - Toshiba

部品番号

コンポーネント説明

メーカー

TPS851
(Rev.:2002)

TOSHIBA Photo IC Silicon Epitaxial Planar

Toshiba 

(2) Recommended soldering pattern

0.65 0.65

Unit: mm

TPS851

0.4

(3) Cleaning conditions

When cleaning is required after soldering

Chemicals: AK225 alcohol

Temperature and time: 50°C ´ 30 s or 30°C ´ 3 mins

Ultrasonic cleaning: 300 W or less

Packing Specification

(1) Packing quantity

Reel (minimum packing quantity)

Carton

3,000 devices

5 reels (15,000 devices)

(2) Packing format

An aluminum envelope containing silica gel and reels is deaerated and sealed.

Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.

· Carton specification

Label

Carton dimensions

(W) 81 mm ´ (L) 280 mm ´ (H) 280 mm

5

2002-04-17

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