TPS853 データシートの表示（PDF） - Toshiba
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TPS853 Datasheet PDF : 14 Pages
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TPS853
Handling Precautions
Insert a bypass condenser of up to 0.1μF between Vcc and GND near the device to stabilize the power supply line.
It takes at least 200 ms when Vcc/Vstb are turned on at the same time or 100 ms when Vstb is turned on after Vcc
is on for the internal circuit to stabilize. During this time the output signal is unstable. Please do not use the
unstable signal as the output signal.
Moisture-Proof Packing
To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica gel.
Since the optical characteristics of the device can be affected during soldering by vaporization resulting
from prior absorption of moisture and they should therefore be stored under the following conditions:
1. If the aluminum bag has been stored unopened
Temperature: 5 to 30°C
Relative humidity: 90% RH (max)
Time: 6 months
2. If the aluminum bag has been opened
Temperature: 5 to 30°C
Relative humidity: 70% RH (max)
Time: 168 h
3. Baking should be conducted within 72 h after the humidity indicator shows > 30% or the bag seal date
is over 6 months. The number of baking should be once. If the baking is conducted repeatedly, it may
affect the peel-back force and cause a problem for mounting.
Baking condition: 60 ± 5°C, 12 to 24 h
Storage period: 12 months from the seal date on the label
4. When the photointerrupter is baked, protect it from electrostatic discharge.
5. Do not toss or drop to avoid damaging the moisture-proof bag.
Mounting Precautions
TPS853 uses a clear resin, and delicate handling is necessary for it.
The characteristic change or the product might be damaged by the handling method of mounting.
Please note the following and handle the product.
(1) Do not apply stress to the resin at high temperature. Time until the product returns at the normal
temperature after mounting of the reflow is different according to the mounting substrate and the
environment. Please do not give the stress with heat remained in the product.
(2) The resin part is easily scratched, so avoid friction with hard materials.
(3) When installing the assembly board in equipment, ensure that this product does not come into
contact with other components.
(4) Please confirm the heat contraction of the substrate of the reflow mounting doesn't influence the
product. The load is given to the product by mounting that the heat contraction is large on the
substrate and the installation position of the substrate. Please note that the characteristic changes or
the product might be damaged.
5
2008-07-10
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