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TN1215-X00G-T データシートの表示(PDF) - STMicroelectronics

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TN1215-X00G-T
ST-Microelectronics
STMicroelectronics ST-Microelectronics
TN1215-X00G-T Datasheet PDF : 12 Pages
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Package information
TN12, TS12 and TYNx12 Series
Table 9. D2PAK dimensions
Dimensions
Ref.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
E
L2
A
C2
A 4.30
A1 2.49
A2 0.03
4.60 0.169
2.69 0.098
0.23 0.001
0.181
0.106
0.009
B 0.70
0.93 0.027
0.037
D
L
B2 1.25 1.40
0.048 0.055
L3
C 0.45
0.60 0.017
0.024
A1
C2 1.21
1.36 0.047
0.054
B2
B
C
R
D 8.95
9.35 0.352
0.368
G
E 10.00
10.28 0.393
0.405
A2
2mm min.
FLAT ZONE
G 4.88
L 15.00
5.28 0.192
15.85 0.590
0.208
0.624
V2
L2 1.27
1.40 0.050
0.055
L3 1.40
1.75 0.055
0.069
R
0.40
0.016
V2 0°
8° 0°
Figure 19. D2PAK footprint dimensions (in millimeters)
16.90
10.30
8.90
5.08
1.30
3.70
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available
at: www.st.com.
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