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UPC8112TB-E3 データシートの表示(PDF) - NEC => Renesas Technology

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UPC8112TB-E3 Datasheet PDF : 20 Pages
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µPC8112TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
LO
C2
input
GND
RF
input
C1
C3
PS bias
PS
C4
VCC
L1
C5
C6
Short
Chip
Voltage supply
IF
output
Short Chip = 1 000 pF
Component Number
C1 to C5
C6
L1
IF 100 MHz Matching
1 000 pF
5 pF
330 nH
IF 240 MHz Matching
1 000 pF
2 pF
84 nH
Remarks
CHIP C
CHIP C
CHIP L
EVALUATION BOARD CHARACTERS AND NOTE
(1) 35 µm thick double-sided copper clad 35 × 42 × 0.4 mm polyimide board
(2) Back side: GND pattern
(3) Solder plated patterns
(4) {: Through holes
(5) To mount C6, pattern should be cut.
CAUTION
Test circuit or print pattern in this sheet is for testing IC characteristics. They are not an application
circuit or recommended system circuit.
In the case of actual system application, external circuits including print pattern and matching circuit
constant of output port should be designed in accordance with IC’s S-parameters and environmental
components.
Remark External circuits of the IC can be referred to following application notes.
USAGE AND APPLICATION CHARACTERISTICS OF µPC2757, µPC2758, AND µPC8112, 3-V POWER
SUPPLY, 1.9-GHz FREQUENCY DOWN-CONVERTER ICS FOR MOBILE COMMUNICATION
(Document No. P11997E)
Data Sheet P12808EJ2V0DS00
7

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