UPD16707 データシートの表示（PDF） - NEC => Renesas Technology

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UPD16707

263/256-OUTPUT TFT-LCD GATE DRIVER

NEC => Renesas Technology 

µ PD16707

7. RECOMMENDED MOUNTING CONDITIONS

The µ PD16707 should be soldered and mounted under the following recommended conditions.

For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact an NEC sales representative.

Recommended Soldering Conditions for Surface Mounting Soldering Conditions.

µ PD16707N-xxx: TCP (TAB Package)

Mounting Condition

Mounting Method

Thermocompression

Soldering

ACF

(Adhesive

Conductive Film)

Condition

Heating tool 300 to 350°C, heating for 2 to 3 seconds : pressure 100g

(per solder)

Temporary bonding 70 to 100°C: pressure 3 to 8 kg/cm2: time 3 to 5 sec.

Real bonding 165 to 180°C: pressure 25 to 45 kg/cm2: time 30 to 40 sec.

(When using the anisotropy conductive film SUMIZAC1003 of

Sumitomo Bakelite,Ltd).

Caution To find out the detailed conditions for mounting the ACF part, please contact the ACF

manufacturing company. Be sure to avoid using two or more mounting methods at a time.

Data Sheet S16411EJ1V0DS

19

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