UPD43256B-XXL データシートの表示（PDF） - NEC => Renesas Technology

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UPD43256B-XXL

256K-BIT CMOS STATIC RAM 32K-WORD BY 8-BIT

NEC => Renesas Technology 

µPD43256B

Recommended Soldering Conditions

The following conditions (See table below) must be met when soldering µPD43256B. For more details, refer to our

document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E).

Please consult with our sales offices in case other soldering process is used, or in case soldering is done under

different conditions.

Types of Surface Mount Device

µPD43256BGU-xxL

: 28-PIN PLASTIC SOP (11.43 mm (450))

µPD43256BGU-xxLL

: 28-PIN PLASTIC SOP (11.43 mm (450))

µPD43256BGU-Axx

: 28-PIN PLASTIC SOP (11.43 mm (450))

µPD43256BGU-Bxx

: 28-PIN PLASTIC SOP (11.43 mm (450))

µPD43256BGW-xxLL-9JL : 28-PIN PLASTIC TSOP (I) (8x13.4) (Normal bent)

µPD43256BGW-xxLL-9KL : 28-PIN PLASTIC TSOP (I) (8x13.4) (Reverse bent)

µPD43256BGW-Axx-9JL : 28-PIN PLASTIC TSOP (I) (8x13.4) (Normal bent)

µPD43256BGW-Axx-9KL : 28-PIN PLASTIC TSOP (I) (8x13.4) (Reverse bent)

µPD43256BGW-Bxx-9JL : 28-PIN PLASTIC TSOP (I) (8x13.4) (Normal bent)

µPD43256BGW-Bxx-9KL : 28-PIN PLASTIC TSOP (I) (8x13.4) (Reverse bent)

Please consult with our sales offices.

Types of Through Hole Mount Device

µPD43256BCZ-xxL : 28-PIN PLASTIC DIP (15.24 mm (600))

µPD43256BCZ-xxLL : 28-PIN PLASTIC DIP (15.24 mm (600))

Soldering process

Soldering conditions

Wave soldering (only to leads)

Partial heating method

Solder temperature : 260 °C or below,

Flow time : 10 seconds or below

Terminal temperature : 300 °C or below,

Time : 3 seconds or below (Per one lead)

Caution Do not jet molten solder on the surface of package.

Data Sheet M10770EJCV0DS00

21

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