UPD72001C-11 データシートの表示（PDF） - NEC => Renesas Technology

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UPD72001C-11

MULTI-PROTOCOL SERIAL CONTROLLERS

NEC => Renesas Technology 

µPD72001-11, 72001-A8

• µPD72001GC-11-3B6 : 52-pin plastic QFP (14 × 14 mm)

µPD72001GC-A8-3B6: 52-pin plastic QFP (14 × 14 mm)

Soldering Method

Infrared reflow

VPS

Wave soldering

Partial heating

Soldering Condition

Package peak temperature: 235 °C, Time: 30 seconds MAX.

(210 °C MIN.), Number of times: 3 MAX.

Package peak temperature: 215 °C, Time: 40 seconds MAX.

(200 °C MIN.), Number of times: 3 MAX.

Solder bath temperature: 260 °C MAX., Time: 10 seconds MAX.,

Number of times: 1

Preheating temperature: 120 °C MAX. (package surface temperature)

Pin temperature: 300 °C MAX., Time: 3 seconds MAX.

(per side of device)

Recommended

Condition Symbol

IR35-00-3

VP15-00-3

WS60-00-1

—

Caution Do not use two or more soldering methods in combination (except partial heating).

• µPD72001L-11: 52-pin plastic QFJ (750 × 750 mil)

Soldering Method

VPS

Partial heating

Soldering Condition

Package peak temperature: 215 °C, Time: 40 seconds MAX.

(200 °C MIN.), Number of times: 1

Pin temperature: 300 °C MAX., Time: 3 seconds MAX.

(per side of device)

Recommended

Condition Symbol

VP15-00-1

—

Through-hole type

• µPD72001C-11 : 40-pin plastic DIP (600 mil)

µPD72001C-A8: 40-pin plastic DIP (600 mil)

Soldering Method

Wave soldering (pins only)

Partial heating

Soldering Condition

Solder bath temperature: 260 °C MAX., Time: 10 seconds MAX.

Pin temperature: 300 °C MAX., Time: 3 seconds MAX.

(per pin)

Caution When soldering this product using of wave soldering, exercise care that the solder does not come

in direct contact with the package.

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