UPD75008CU-XXX データシートの表示（PDF） - NEC => Renesas Technology

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UPD75008CU-XXX

4-BIT SINGLE-CHIP MICROCOMPUTER

NEC => Renesas Technology 

µPD75004, 75006, 75008

13. RECOMMENDED SOLDERING CONDITIONS

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It is recommended that µPD75004, 75006, and 75008 be soldered under the following conditions.

For details on the recommended soldering conditions, refer to Information Document "Semiconductor

Devices Mounting Manual" (IEI-616).

The soldering methods and conditions are not listed here, consult NEC.

Table 13-1 Soldering Conditions

µPD75004GB - xxx - 3B4: 44-pin plastic QFP (s10 mm)

µPD75006GB - xxx - 3B4: 44-pin plastic QFP (s10 mm)

µPD75008GB - xxx - 3B4: 44-pin plastic QFP (s10 mm)

Soldering Method

Infrared Reflow

VPS

Wave Soldering

Pin Partial Heating

Soldering Conditions

Symbol for Recommended

Condition

Package peak temperature: 230°C, time: 30 seconds max.

(210°C min.), number of times: 1, number of days: 7 days*,

(afterwards, 10 hours of prebaking at 125°C is required.)

Package peak temperature: 215°C, time: 40 seconds max.

(200°C min.), number of times: 1, number of days: 7 days*,

(afterwards, 10 hours of prebaking at 125°C is required.)

Soldering bath temperature: 260°C max., time: 10 seconds

max., number of times: 1, number of days: 7 days*,

(afterwards, 10 hours of prebaking at 125°C is required.)

pre-heating temperature: 120°C max. (package surface

temperature)

IR30-107-1

VP15-107-1

WS60-00-1

Pin temperature: 300°C max.,

—

time: 3 seconds max. (per side)

*: This means the number of days after unpacking the dry pack. Storage conditions are 25°C and 65%

RH max.

Caution: Do not use two or more soldering methods in combination (except the pin partial heating

method).

Table 13-2 Soldering Conditions of Through-Hole Type

µPD75004CU - xxx : 42-pin plastic shrink DIP (600 mil)

µPD75006CU - xxx : 42-pin plastic shrink DIP (600 mil)

µPD75008CU - xxx : 42-pin plastic shrink DIP (600 mil)

Soldering Method

Wave Soldering

(Only for lead part)

Pin Partial Heating

Soldering Conditions

Soldering bath temperature: 260°C max., Time: 10 seconds max.

Pin temperature: 260°C max., Time: 10 seconds max.

Notice

A model that can be soldered under the more stringent conditions (infrared reflow peak temperature:

235°C, number of times: 2, and an extended number of days) is also available.

For details, consult NEC.

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