UPD75212ACW データシートの表示（PDF） - NEC => Renesas Technology

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UPD75212ACW

4-BIT SINGLE-CHIP MICROCOMPUTER

NEC => Renesas Technology 

µPD75212A

15. RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the conditions recommended below.

For details of recommended soldering conditions, refer to the information document “Semiconductor Device

Mount Manual” (IEI-1207).

For soldering methods and conditions other than those recommended below, contact our salesman.

Table 15-1 Surface Mounting Type Conditions

µPD75212AGF-×××-3BE : 64-pin plastic QFP (14 × 20 mm)

Soldering Method

Soldering Conditions

Wave soldering

Infrared reflow

VPS

Pin part heating

Solder bath temperature: 260 °C or less, Duration: 10 sec. max.

Number of times: Once, Time limit: 7 days* (thereafter 10 hours prebaking required

at 125 °C)

Preheating temperature : 120 °C max. (package surface temperature)

Package peak temperature: 230 °C, Duration: 30 sec. max. (at 210 °C or above),

Number of times: Once, Time limit: 7 days*(thereafter 10 hours prebaking required

at 125 °C)

Package peak temperature: 215 °C, Duration: 40 sec. max. (at 200 °C or above),

Number of times: Once, Time limit: 7 days* (thereafter 10 hours prebaking required

at 125 °C)

Pin part temperature: 300 °C or below , Duration: 3 sec. max. (per device side)

Recommended

Condition Symbol

WS60-107-1

IR-30-107-1

VP15-107-1

–––

* For the storage period after dry-pack decompression storage conditions are max. 25 °C, 65 % RH.

Note Use of more than one soldering method should be avoided (except in the case of pin part heating).

Notice

A Version of this product with improved recommended soldering condition is available. For details

(improvements such as infrared reflow peak temperature extension (235 °C), number of times: twice,

relaxation of time limit, etc.), contact NEC sales personnel.

Table 15-2 Insertion Type Soldering Conditions

µPD75212ACW-××× : 64-pin plastic shrink DIP (750 mil)

Soldering Method

Soldering Conditions

Wave soldering

(lead part only)

Pin part heating

Solder bath temperature: 260 °C or below , Duration: 10 sec. max.

Pin part temperature: 260 °C or below , Duration: 10 sec. max.

Note Ensure that the application of wave soldering is limited to the lead part and no solder touches the main

unit directly.

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