UPD77115A データシートの表示（PDF） - NEC => Renesas Technology

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UPD77115A

16-BIT FIXED-POINT DIGITAL SIGNAL PROCESSOR

NEC => Renesas Technology 

µPD77115, 77115A

10. RECOMMENDED SOLDERING CONDITIONS

It is recommended to solder this product under the following conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Surface-Mount Type

• µ PD77115GK-9EU: 80-pin plastic TQFP (fine-pitch) (12 × 12)

Soldering Process

Soldering Conditions

Infrared ray reflow

VPS

Partial heating method

Package peak temperature: 235°C, Time: 30 seconds MAX (210°C MIN),

Number of times: 2 MAX, Number of days: 3Note (after that, prebaking is necessary

for 10 to 72 hours at 125°C))

Package peak temperature: 215°C, Time: 40 seconds MAX (200°C MIN),

Number of times: 2 MAX, Number of days: 3Note (after that, prebaking isnecessary

for 10 to 72 hours at 125°C)

Pin temperature: 300°C MAX, Time: 3 seconds MAX (per side of device)

Symbol

IR35-103-2

VP15-103-2

−

• µ PD77115F1-CN6: 80-pin plastic FBGA (9 × 9)

• µ PD77115AF1-xxx-CN6: 80-pin plastic FBGA (9 × 9)

Soldering Process

Soldering Conditions

Infrared ray reflow

VPS

Package peak temperature: 235°C, Time: 30 seconds MAX (210°C MIN),

Number of times: 2 MAX, Number of days: 3Note (after that, prebaking is necessary

for 10 to 72 hours at 125°C))

Package peak temperature: 215°C, Time: 40 seconds MAX (200°C MIN),

Number of times: 2 MAX, Number of days: 3Note (after that, prebaking isnecessary

for 10 to 72 hours at 125°C)

Symbol

IR35-103-2

VP15-103-2

Note Number of days in storage after the dry pack has been opened. The storage conditions are at 25°C, 65%

RH MAX.

Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with

the package.

Data Sheet U14867EJ5V0DS

53

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