VO3526 データシートの表示（PDF） - Vishay Semiconductors
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VO3526 Datasheet PDF : 8 Pages
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VO3526
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
COUPLER
Total power dissipation
Pdiss
1.2
W
Ambient temperature range
Tamb
- 40 to + 85
°C
Storage temperature range
Soldering temperature (1)
t ≤ 10 s max.
Tstg
- 40 to + 125
°C
Tsld
260
°C
Isolation test voltage
for 1.0 s
VISO
5300
VRMS
Notes
• Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
(1) Refer to wave profile for soldering conditions for through hole devices.
(2) Total power dissipation value is based on 2S2P PCB. Refer to power phototriac application note for PCB design tips.
ABSOLUTE MAXIMUM RATING CURVES
80
60
40
20
21296
0
- 40 - 20 0 20 40 60 80 100 120
TA - Ambient Temperature (°C)
Fig. 1 - Power Dissipation vs. Temperature
1.2
1.0
0.8
0.6
0.4
0.2
0
- 40 - 20 0 20 40 60 80 100 120
21502
Ambient Temperature (°C)
Fig. 2 - Allowable Load Current vs. Ambient Temperature
Note
• The allowable load current was calculated out under a given
operating conditions and only for reference:
LED power: QE = 0.015 W, θBA (4-layer) = 30 °C/W
THERMAL CHARACTERISTICS
PARAMETER
SYMBOL
VALUE
UNIT
Maximum LED junction temperature
Maximum NOT junction temperature
Thermal resistance, junction NOT to bord
Thermal resistance, junction NOT to case
Thermal resistance, junction OT to board
Thermal resistance, junction OT to case
Thermal resistance, junction emitter to board
Thermal resistance, junction emitter to case
Thermal resistance, junction NOT to junction OT
Thermal resistance, junction emitter to junction NOT
Thermal resistance, junction emitter to junction OT
Thermal resistance, case to ambient
Tjmax.
105
Tjmax.
105
θNOT-B
75
θNOT-C
150
θOT-B
158
θOT-C
157
θE-B
149
θE-C
161
θNOT-OT
243
θE-NOT
420
θE-OT
235
θCA
130
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Note
• The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the
temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of
PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay's Thermal
Characteristics of Power Phototriac application note.
Rev. 1.3, 24-Sep-12
2
Document Number: 81842
For technical questions, contact: optocoupler.answers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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