VSC8169QR データシートの表示（PDF） - Vitesse Semiconductor
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VSC8169QR Datasheet PDF : 18 Pages
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VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Data Sheet
VSC8169
OC-48 (FEC) 16:1 SONET/SDH
MUX with Clock Generator
Thermal Considerations
This package has been enhanced with a copper heat slug to provide a low thermal resistance path from the
die to the exposed surface of the heat spreader. The thermal resistance is shown in the Table 4.
Table 4: Thermal Resistance
Symbol
θJC
θCA
Description
Thermal resistance from junction-to-case.
Thermal resistance from case-to-ambient with no airflow, including conduction
through the leads.
°C/W
1.34
25.0
Thermal Resistance with Airflow
Shown in the Table 5 is the thermal resistance with airflow. This thermal resistance value reflects all the
thermal paths including through the leads in an environment where the leads are exposed. The temperature dif-
ference between the ambient airflow temperature and the case temperature should be the worst case power of
the device multiplied by the thermal resistance.
Table 5: Thermal Resistance with Airflow
Airflow
100 lfpm
200 lfpm
400 lfpm
600 lfpm
θca (oC/W)
21
18
16
14.5
Maximum Ambient Temperature without Heatsink
The worst-case ambient temperature without use of a heatsink is given by the equation:
TA(MAX) = TC(MAX) – P(MAX)θCA
where:
θCA
ΤA(MAX)
ΤC(MAX)
P(MAX)
Theta case-to-ambient at appropriate airflow
Ambient air temperature
Case temperature (85oC for VSC8169)
Power (1.7 W for VSC8169)
G52230-0, Rev 3.6
01/02/01
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Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
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