25X10AVNIG データシートの表示（PDF） - Winbond

部品番号

コンポーネント説明

メーカー

25X10AVNIG

1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

Winbond 

W25X10A, W25X20A, W25X40A, W25X80A

8-Pad WSON 6x5mm Cont’d.

SYMBOL

MILLIMETERS

MIN

TYP.

MAX

SOLDER PATTERN

M

3.40

N

4.30

P

6.00

Q

0.50

R

0.75

INCHES

MIN

TYP.

MAX

0.1338

0.1692

0.2360

0.0196

0.0255

Notes:

1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.

4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of

exposed PCB vias under the pad

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