25Q80BVAAG データシートの表示（PDF） - Winbond

部品番号

コンポーネント説明

メーカー

25Q80BVAAG

8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

Winbond 

8-Pad WSON 6x5mm Cont’d.

W25Q80BV

SYMBOL

M

N

P

Q

R

MILLIMETERS

Min

Nom Max

Min

SOLDER PATTERN

3.40

4.30

6.00

0.50

0.75

INCHES

Nom

0.134

0.169

0.236

0.020

0.026

Max

Notes:

1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.

4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of

exposed PCB vias under the pad.

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