CXA2020M データシートの表示（PDF） - Sony Semiconductor

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CXA2020M

EIAJ Sound Multiplexing Decoder

Sony Semiconductor 

Package Outline

Unit: mm

CXA2020M

28

28PIN SOP (PLASTIC) 375mil

+ 0.4

18.8 – 0.1

15

+ 0.4

2.3 – 0.15

0.15

+ 0.2

0.1 – 0.05

1

0.45 ± 0.1

14

1.27

+ 0.1

0.2 – 0.05

± 0.12 M

SONY CODE

EIAJ CODE

JEDEC CODE

SOP-28P-L04

∗SOP028-P-0375-D

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

EPOXY / PHENOL RESIN

SOLDER PLATING

42 ALLOY

0.7g

CXA2020S

22PIN SDIP (PLASTIC)

+ 0.4

19.2 – 0.1

22

12

1

11

1.778

0° to 15°

CXA2020M/S

0.5 ± 0.1

+ 0.15

0.9 – 0.1

SONY CODE

EIAJ CODE

JEDEC CODE

SDIP-22P-01

SDIP022-P-0300

PACKAGE STRUCTURE

MOLDING COMPOUND EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

PACKAGE WEIGHT

COPPER ALLOY

0.95g

– 18 –

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