74LV259 データシートの表示（PDF） - NXP Semiconductors.
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74LV259 Datasheet PDF : 19 Pages
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NXP Semiconductors
74LV259
8-bit addressable latch
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
c
y
Z
16
9
E
A
X
HE
vM A
pin 1 index
1
e
8
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (2)
e
HE
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT403-1
MO-153
L
Lp
Q
v
w
y
Z (1) θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.40
0.06
8o
0o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 16. Package outline SOT403-1 (TSSOP16)
74LV259_3
Product data sheet
Rev. 03 — 2 January 2008
© NXP B.V. 2008. All rights reserved.
15 of 19
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