ADG1409YRUZ-REEL7(Rev0) データシートの表示（PDF） - Analog Devices

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ADG1409YRUZ-REEL7
(Rev.:Rev0)

4 Ω RON, 4-/8-Channel ±15 V/+12 V/±5 V iCMOS™ Multiplexers

Analog Devices 

ADG1408/ADG1409

OUTLINE DIMENSIONS

5.10

5.00

4.90

16

9

4.50

4.40

4.30

1

6.40

BSC

8

PIN 1

1.20

0.15

MAX

0.20

0.05

0.09

0.75

0.30

8°

0.60

0.65

BSC

0.19 SEATING

PLANE

0°

0.45

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 37. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

ORDERING GUIDE

Model

ADG1408YRUZ1

ADG1408YRUZ-REEL1

ADG1408YRUZ-REEL71

ADG1408YCPZ-REEL71

ADG1409YRUZ1

ADG1409YRUZ-REEL1

ADG1409YRUZ-REEL71

ADG1409YCPZ-REEL71

1 Z = Pb-free part.

PIN 1

INDICATOR

4.00

BSC SQ

TOP VIEW

12° MAX

1.00

0.85

0.80

SEATING

PLANE

0.30

0.23

0.18

0.50

0.40

0.60 MAX

0.30

12 13

16 1

3.75

BSC SQ

EXPOSED

PAD

4

0.65

98

5

BSC

0.80 MAX

0.65 TYP

1.95 BCS

BOTTOM VIEW

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

PIN 1

INDICATOR

2.65

2.50 SQ

2.35

0.25 MIN

COMPLIANT TO JEDEC STANDARDS MO-220-VGGC.

Figure 38. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm, Very Thin Quad (CP-16-13)

Dimensions shown in millimeters

Temperature Range

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

Package Description

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

Package Option

RU-16

RU-16

RU-16

CP-16-13

RU-16

RU-16

RU-16

CP-16-13

Rev. 0 | Page 19 of 20

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