ADP2105 データシートの表示（PDF） - Analog Devices

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ADP2105

1 A/1.5 A/2 A Synchronous, Step-Down DC-to-DC Converters

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

IN, EN, SS, COMP, FB to AGND

LX1, LX2 to PGND

PWIN1, PWIN2 to PGND

PGND to AGND

GND to AGND

PWIN1, PWIN2 to IN

Operating Junction Temperature Range

Storage Temperature Range

Soldering Conditions

Rating

−0.3 V to +6 V

−0.3 V to (VIN + 0.3 V)

−0.3 V to +6 V

−0.3 V to +0.3 V

−0.3 V to +0.3 V

−0.3 V to +0.3 V

−40°C to +125°C

−65°C to +150°C

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

ADP2105/ADP2106/ADP2107

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA

16-Lead LFCSP

40

Maximum Power Dissipation

1

Unit

°C/W

W

BOUNDARY CONDITION

Natural convection, 4-layer board, exposed pad soldered to the PCB.

ESD CAUTION

Rev. E | Page 7 of 36

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