BAP50-02 データシートの表示（PDF） - NXP Semiconductors.
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BAP50-02 Datasheet PDF : 9 Pages
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NXP Semiconductors
BAP50-02
General purpose PIN diode
2 Pinning information
Table 1. Discrete pinning
Pin Description
1
cathode
2
anode
Simplified outline Graphic symbol
1
2
sym006
Top view
3 Ordering information
Table 2. Ordering information
Type number Package
Name Description
BAP50-02
-
plastic surface-mounted package; 2 leads
4 Marking
Table 3. Marking code
Type number
BAP50-02
Marking code
K4
5 Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
VR
continuous forward
-
voltage
IF
continuous forward
-
current
Ptot
total power dissipation Tsp ≤ 90 °C
-
Tstg
storage temperature
-65
Tj
junction temperature
-65
6 Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter
Rth(j-sp)
thermal resistance from junction to
solder point
Conditions
Version
SOD523
Max
Unit
50
V
50
mA
715
mW
+150
°C
+150
°C
Typ Unit
85 K/W
BAP50-02
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 November 2018
© NXP B.V. 2018. All rights reserved.
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