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0603YC104KAT2A

MCP2210 Breakout Module User’s Guide

Microchip Technology 

MCP2210 BREAKOUT MODULE

USER’S GUIDE

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and

documentation are constantly evolving to meet customer needs, so some actual dialogs

and/or tool descriptions may differ from those in this document. Please refer to our web site

(www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each

page, in front of the page number. The numbering convention for the DS number is

“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the

document.

For the most up-to-date information on development tools, see the MPLAB® IDE online help.

Select the Help menu, and then Topics to open a list of available online help files.

INTRODUCTION

This chapter contains general information that will be useful to know before using the

MCP2210 Breakout Module. Items discussed in this chapter include:

• Document Layout

• Conventions Used in this Guide

• Recommended Reading

• The Microchip Web Site

• Customer Support

• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the MCP2210 Breakout Module board. The

manual layout is as follows:

• Chapter 1. “Product Overview” – Important information about the MCP2210

Breakout Module

• Chapter 2. “Installation and Operation” – Covers the initial set-up of this board,

required tools, board setup and Graphical User Interface (GUI)

• Appendix A. “Schematic and Layouts” – Shows the schematic and board

layouts for the MCP2210 Breakout Module User’s Guide

• Appendix B. “Bill of Materials” – Lists the parts used to populate the MCP2210

Breakout Module

© 2012 Microchip Technology Inc.

DS52056A-page 5

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