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DS28E01-100 データシートの表示(PDF) - Dallas Semiconductor -> Maxim Integrated

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DS28E01-100
Dallas
Dallas Semiconductor -> Maxim Integrated Dallas
DS28E01-100 Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
Abridged Data Sheet
DS28E01-100
PIN CONFIGURATION (CONTINUED)
PIN CONFIGURATION (CONTINUED)
12
SFN, pinout:
Pin 1 -------------
Pin 2 -------------
IO
GND
Bottom View Side View
SFN, approx. 6 x 6 x 0.9 mm
Package Outline Drawing 56-00SFN-000
The SFN Package is qualified for electromechanical
contact applications only, not for soldering.
A1 Mark
µCSP*, Top View with
Laser Mark, Contacts
A
Not Visible.
DS28E01 A2 = IO
B yywwrr
A3 = GND
###xx
All Other Bumps: NC
C
yywwrr = Date/Revision
###xx = Lot Number
123
See 21-0093, pkg. code B9-8, for package outline.
* Refer to package reliability report for important
guidelines on qualified usage conditions.
SFN PACKAGE ORIENTATION ON
TAPE-AND-REEL
ORDERING INFORMATION
(CONTINUED)
PART
DS28E01X-100
DS28E01X-100-S
TEMP RANGE
-40 to 85°C
-40 to 85°C
PIN-PACKAGE
µCSP, 10k pcs,
Tape-and-Reel
µCSP, 2.5k pcs,
Tape-and-Reel
Contact factory for availability of the µCSP.
User Direction of Feed
Leads face up in orientation shown above.
PACKAGE INFORMATION
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to
www.maxim-ic.com/DallasPackInfo.)
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