HEXFREDTM
Features
Reduced RFI and EMI
Reduced Snubbing
Extensive Characterization of
Recovery Parameters
PD -2.468 rev. B 02/99
HFA90NH40
Ultrafast, Soft Recovery Diode
LUG
TERMINAL
ANODE
a
d
BASE CATHODE
VR = 400V
VF(typ.)= 1V
IF(AV) = 90A
Qrr (typ.) = 420nC
IRRM(typ.) = 9.3A
trr(typ.) = 36ns
di(rec)M/dt (typ.) = 260A/µs
Description
HEXFREDTM diodes are optimized to reduce losses and EMI/RFI in high frequency
power conditioning systems. An extensive characterization of the recovery
behavior for different values of current, temperature and di/dt simplifies the
calculations of losses in the operating conditions. The softness of the recovery
eliminates the need for a snubber in most applications. These devices are
ideally suited for power converters, motors drives and other applications where
switching losses are significant portion of the total losses.
HALF-PAK
Absolute Maximum Ratings (per Leg)
Parameter
VR
IF @ TC = 25°C
IF @ TC = 100°C
IFSM
EAS
PD @ TC = 25°C
PD @ TC = 100°C
TJ
TSTG
Cathode-to-Anode Voltage
Continuous Forward Current
Continuous Forward Current
Single Pulse Forward Current
Non-Repetitive Avalanche Energy
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Max.
400
170
84
600
1.4
310
125
-55 to +150
Units
V
A
mJ
W
°C
Thermal - Mechanical Characteristics
Parameter
RthJC
RthCS
Wt
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Weight
Mounting Torque
Terminal Torque
Vertical Pull
2 inch Lever Pull
Min.
15 (1.7)
30 (3.4)
Typ.
0.15
26 (0.9)
Max.
0.40
25 (2.8)
40 (4.6)
35
35
Units
°C/W
K/W
g (oz)
lbfin
(Nm)
lbfin
Note: Limited by junction temperature
L = 100µH, duty cycle limited by max TJ
125°C
Mounting surface must be smooth, flat, free or burrs or other
protrusions. Apply a thin even film or thermal grease to mounting
surface. Gradually tighten each mounting bolt in 5-10 lbfin steps
until desired or maximum torque limits are reached. Module
1