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HY27UAXXX データシートの表示(PDF) - Hynix Semiconductor

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HY27UAXXX Datasheet PDF : 43 Pages
First Prev 41 42 43
MARKING INFORMATION
Packag
HY27UA(08/16)1G1M Series
HY27SA(08/16)1G1M Series
1Gbit (128Mx8bit / 64Mx16bit) NAND Flash
Marking Example
TSOP1
/
WSOP1
/
FBGA
K
O
R
HY
2
7
x
A
x
x
1
G
1M
x
x
x
x
Y WW
x
x
- hynix
- KOR
: Hynix Symbol
: Origin Country
- HY27xAxx121mTxB
: Part Number
HY: HYNIX
27: NAND Flash
x: Power Supply
: U(2.7V~3.6V), S(1.7V~2.2V)
A: Classification
: Single Level Cell+Double Die
xx: Bit Organization
: 08(x8), 16(x16)
1G: Density
: 1Gb
1: Mode
: 1nCE & 1R/nB; CE don't care
M: Version
: 1st Generation
x: Package Type
: T(TSOP1), V(WSOP1), F(FBGA)
x: Package Material
: Blank(Normal), P(Lead Free)
x: Operating Temperature
: C(0~70), E(-25~85)
I(-40~85)
x: Bad Block
: B(Included Bad Block), S(1~5 Bad Block),
P(All Good Block)
- Y: Year (ex: 4=year 2004, 05= year 2005)
- ww: Work Week (ex: 12= work week 12)
- xx: Process Code
Note
- Capital Letter
- Small Letter
: Fixed Item
: Non-fixed Item
Rev 0.5 / Oct. 2004
43

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