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ICM7555ID データシートの表示(PDF) - NXP Semiconductors.

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ICM7555ID
NXP
NXP Semiconductors. NXP
ICM7555ID Datasheet PDF : 22 Pages
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NXP Semiconductors
ICM7555
General purpose CMOS timer
16. Revision history
Table 10. Revision history
Document ID Release date
Data sheet status
Change notice
Supersedes
ICM7555_2
Modifications:
20090803
Product data sheet
-
ICM7555_1
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP
Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Provided separate pinning diagrams for SO8 and DIP8 packages (Figure 2 and Figure 3,
respectively).
Added Table 2 “Pin description”.
Table 4 “Limiting values”:
Symbols VTRIG, VCV, VTH, VRST are replaced with VI (specific pin names are now noted under
Conditions column).
Symbol/parameter “PDMAX, maximum power dissipation” replaced with “P, power dissipation” (only
maximum values given).
Symbol/parameter “TSTG, storage temperature range” replaced with “Tstg, storage temperature”.
Symbol changed from “TSOLD” to “Tsp, solder point temperature”
Table 5 “Characteristics”:
Symbols f/f, f/V, f/T, have been added for Astable mode timing.
Symbols VTRIG, VCV, VTH, VRST are replaced with VI (specific pin names are now noted under
Conditions column).
Symbols ITRIG, ITH, IRST are replaced with II (specific pin names are now noted under Conditions
column).
Symbol/parameter “VDIS, discharge output voltage” changed to “Vo, output voltage” (specific pin
name is now noted under Conditions column).
Symbol/parameter “tR, rise time of output” changed to “tr(o), output rise time”.
Symbol/parameter “tF, fall time of output” changed to “tf(o), output fall time”.
Symbol “FMAX” changed to “fosc, oscillator frequency”.
Section 11.4 “Astable operation”: changed symbol for duty cycle from “D” to “δ”.
Added Section 12 “Package outline”.
Added soldering information.
Added Section 15 “Abbreviations”.
ICM7555_1
19940831
Product specification
ECN 853-1192 13721 -
dated 1994 Aug 31
ICM7555_2
Product data sheet
Rev. 02 — 3 August 2009
© NXP B.V. 2009. All rights reserved.
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