IS61SP6464
ISSI ®
POWER SUPPLY CHARACTERISTICS (Over Operating Range)
Symbol Parameter
Test Conditions
-117 -100
Max. Max.
Unit
ICC
AC Operating
Device Selected,
Com.
270 250
mA
Supply Current
All Inputs = VIL or VIH
Ind.
270
OE = VIH,
Cycle Time ≥ tKC min.
ISB1
Standby Current Device Deselected,
Com.
70
70
mA
TTL Inputs
VDD = Max.,
Ind.
80
All Inputs = VIH or VIL
CLK Cycle Time ≥ tKC min.
ISB2
Standby Current Device Deselected,
Com.
20
20
mA
CMOS Inputs
VDD = Max.,
Ind.
30
VIN ≥ VDD – 0.2V, or VIN ≤ 0.2V
CLK Cycle Time ≥ tKC min.
IZZ
Power-Down Mode ZZ = VDDQ, CLK Running
Com.
20
20
mA
Current
All Inputs ≤ GND + 0.2V
Ind.
30
or ≥ VDD – 0.2V
Notes:
1. The MODE pin has an internal pullup. ZZ pin has an internal pull-down. This pin may be a No Connect, tied to GND, or tied to
VDDQ.
2. The MODE pin should be tied to VDD or GND. It exhibits ±10 µA maximum leakage current when tied to ≤ GND + 0.2V
or ≥ VDD – 0.2V.
8
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. C
01/14/04