LTC3400 データシートの表示（PDF） - Linear Technology
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LTC3400 Datasheet PDF : 12 Pages
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LTC3400/LTC3400B
APPLICATIO S I FOR ATIO
PCB LAYOUT GUIDELINES
The high speed operation of the LTC3400/LTC3400B
demands careful attention to board layout. You will not get
advertised performance with careless layout. Figure 2
shows the recommended component placement. A large
ground pin copper area will help to lower the chip tempera-
ture. A multilayer board with a separate ground plane is
ideal, but not absolutely necessary.
(OPTIONAL)
VIN
1 SW VIN 6
2 GND VOUT 5
3 FB SHDN 4
SHDN
VOUT
3400 F02
RECOMMENDED COMPONENT PLACEMENT. TRACES
CARRYING HIGH CURRENT ARE DIRECT. TRACE AREA AT
FB PIN IS SMALL. LEAD LENGTH TO BATTERY IS SHORT
Figure 2. Recommended Component Placement
for Single Layer Board
COMPONENT SELECTION
Inductor Selection
The LTC3400/LTC3400B can utilize small surface mount
and chip inductors due to their fast 1.2MHz switching
frequency. A minimum inductance value of 3.3µH is
necessary for 3.6V and lower voltage applications and
4.7µH for output voltages greater than 3.6V. Larger values
of inductance will allow greater output current capability
by reducing the inductor ripple current. Increasing the
inductance above 10µH will increase size while providing
little improvement in output current capability.
The approximate output current capability of the LTC3400/
LTC3400B versus inductance value is given in the equa-
tion below and illustrated graphically in Figure 3.
180 VIN =1.2V
160
140
VOUT = 3V
VOUT = 3.3V
VOUT = 3.6V
120
VOUT = 5V
110
80
60
3 5 7 9 11 13 15 17 19 21 23
INDUCTANCE (µH)
3400 F03
Figure 3. Maximum Output Current vs
Inductance Based On 90% Efficiency
IOUT(MAX) = η • IP – fV•INL••D2 • (1– D)
where:
η = estimated efficiency
IP = peak current limit value (0.6A)
VIN = input (battery) voltage
D = steady-state duty ratio = (VOUT – VIN)/VOUT
f = switching frequency (1.2MHz typical)
L = inductance value
The inductor current ripple is typically set for 20% to 40%
of the maximum inductor current (IP). High frequency
ferrite core inductor materials reduce frequency depen-
dent power losses compared to cheaper powdered iron
types, improving efficiency. The inductor should have low
ESR (series resistance of the windings) to reduce the I2R
power losses, and must be able to handle the peak
inductor current without saturating. Molded chokes and
some chip inductors usually do not have enough core to
support the peak inductor currents of 850mA seen on the
LTC3400/LTC3400B. To minimize radiated noise, use a
toroid, pot core or shielded bobbin inductor. See Table 1
for some suggested components and suppliers.
3400f
6
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