MAS9275 データシートの表示（PDF） - Micro Analog systems

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MAS9275

IC FOR 10.00 – 36.00 MHz VCXO

Micro Analog systems 

DA9275.007

19 February 2004

PIN DESCRIPTION

Pin Description

Crystal/Varactor Oscillator Input

Voltage Control Input

Power Supply Ground

Buffer Output

Power Supply Voltage

Tri State

Crystal Oscillator Output

Symbol

X1

VC

VSS

OUT

VDD

PD

X2

x-coordinate

209

425

600

1029

841

379

197

y-coordinate

161

165

175

1030

1016

1028

1030

Note

Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or

left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component

assembly are recommended to be performed in ESD protected area.

Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location, however, distances between pads are accurate.

ABSOLUTE MAXIMUM RATINGS

Parameter

Supply Voltage

Input Pin Voltage

Power Dissipation

Storage Temperature

ESD Rating

Symbol

VDD -

VSS

PMAX

TST

Conditions

HBM

Min

Max

-0.3

6.0

VSS -0.3

-55

VDD + 0.3

100

120

2

Unit

V

V

mW

oC

kV

Note

RECOMMENDED OPERATION CONDITIONS

Parameter

Supply Voltage

Supply Current

Operating Temperature

Voltage Control Line

Impedance

Crystal Pulling Sensitivity

Crystal Load Capacitance

Symbol

VDD

IDD

TOP

VcIMP

S

CL

Conditions

VDD = 2.8 V

MAS9275A,

MAS9275B

VC = 1.65 V

MAS9275A1

MAS9275B2

MAS9275B3

MAS9275C2

MAS9275C3

MAS9275C4

Min Typ Max Unit

2.5

2.8 5.5

V

2.3

mA

-40

+85

oC

1

MΩ

30

ppm/pF

pF

8

10

10.5

10

10.5

10.5

Note 1: It is recommend to connect a 1 nF capacitor to the VDD pin (either in a module or in an end

application).

Note 2: Crystal Load Capacitance is typically 8.2 pF, when VC = 2.5 V.

Note

1)

2)

2)

2)

2 (10)

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