MJW16206 データシートの表示（PDF） - ON Semiconductor

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コンポーネント説明

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MJW16206

POWER TRANSISTORS

ON Semiconductor 

MJW16206

TEST CONDITIONS FOR ISOLATION TESTS*

MOUNTED

FULLY ISOLATED

PACKAGE

LEADS

MOUNTED

FULLY ISOLATED

PACKAGE

0.099" MIN

LEADS

HEATSINK

0.110" MIN

HEATSINK

Figure 19. Screw or Clip Mounting Position

for Isolation Test Number 1

Figure 20. Screw or Clip Mounting Position

for Isolation Test Number 2

*Measurement made between leads and heatsink with all leads shorted together.

MOUNTING INFORMATION**

4-40 SCREW

CLIP

PLAIN WASHER

HEATSINK

COMPRESSION WASHER

NUT

HEATSINK

Figure 21. Typical Mounting Techniques*

Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw

torque of 6 to 8 in . lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain a con-

stant pressure on the package over time and during large temperature excursions.

Destructive laboratory tests show that using a hex head 4-40 screw, without washers, and applying a torque in excess of 20 in . lbs will

cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.

Additional tests on slotted 4-40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting the pack-

age. However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does not recommend

exceeding 10 in . lbs of mounting torque under any mounting conditions.

** For more information about mounting power semiconductors see Application Note AN1040.

http://onsemi.com

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