NE38018
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Conditions
Package peak temperature: 230°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limitNote: None
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limitNote: None
Soldering bath temperature: 260°C or below
Time: 10 seconds or less
Count: 1, Exposure limitNote: None
Pin temperature: 230°C
Time: 10 seconds or less (per pin row)
Exposure limitNote: None
Recommended Condition
Symbol
IR30-00-3
VP15-00-3
WS60-00-1
–
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
PRECAUTION Avoid high static voltage and electric fields, because this device is Hetero Junction field
effect transistor with shottky barrier gate.
Preliminary Data Sheet
13