SIW3500GIG1 データシートの表示（PDF） - RF Micro Devices

部品番号

コンポーネント説明

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SIW3500GIG1

ULTIMATEBLUE

RF Micro Devices 

Preliminary

SiW3500

Packaging and Product Marking

Package Drawing

Green package, 96-Pin, 6 mm x6 mm, VFBGA Drawing and Dimensions

Symbol

A

A1

A2

A3

b

D

E

e

D1

E1

Min

Max

0.8

1.0

0.2

0.3

0.22 REF

0.45 REF

0.25

0.35

6 BSC

6 BSC

0.5 BSC

5 BSC

5 BSC

Notes:

1. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.

2. Datum Z is defined by the spherical crowns of the solder balls.

3. Parallelism measurement shall exclude any effect of mark on top surface of package.

4. All dimensions are in millimeters.

5. VFBGA green package solder ball material: 95.5% Sn, 4% Ag, 0.5% Cu.

60 0066 R00Hrf SiW3500 Radio Processor DS

14-53

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