Philips Semiconductors
GSM/DCS/PCS power amplifier
APPLICATION INFORMATION
Preliminary specification
CGY2014TT
handbook, full pagewViddth23DCS
10 nF
TRL2
RFinDCS
Vd1DCS
Vd1GSM
1 nF
RFinGSM
Vd23GSM
3.9 nH
n.c.
1
RFIHB 2
n.c.
20
19 n.c.
TRL1
1
1 nF
pF
4.7
VDD1HB 3
VDD2HB
4
18 RFO/VDD3HB
RFO/VDD3HB
17
pF
100 pF VDD2HB
5
16 n.c.(1)
VDD2LB CGY2014TT
6
15
GND
100 pF
3.3 nH
6 pF
VDD1LB 7
GND1LB 8
14 RFO/VDD3LB
13 RFO/VDD3LB
RFILB 9
n.c.
12
n.c. 10
11 n.c.
TRL6
1 nF 56 pF
4 pF
TRL3
2.7 pF
3 pF
RFoutDCS
5.6 pF
BA891
3.3 kΩ
Vpin
TRL4 TRL5
4.7 pF
100 pF
RFoutGSM
9.1 pF
FCA174
(1) Pin 16 is internally connected to ground and should not be connected to the board.
(2) Transmission lines:
Thickness 0.4 mm, substrate FR4 and εr = 4.7.
TRL1: width = 500 µm, length = 4.5 mm.
TRL2: width = 500 µm, length = 20 mm.
TRL3: width = 150 µm, length = 30 mm.
TRL4: width = 500 µm, length = 4 mm.
TRL5: width = 500 µm, length = 1.5 mm.
TRL6: width = 500 µm, length = 13 mm.
Fig.7 Application diagram.
2000 Apr 11
8