TOP232G データシートの表示（PDF） - Power Analog Micoelectronics

部品番号

コンポーネント説明

メーカー

TOP232G

Design Flexible, EcoSmart, Integrated Off-line Switcher

Power Analog Micoelectronics 

TOP232-234

-E-

.245 (6.22)

.255 (6.48)

Pin 1

-D-

.128 (3.25)

.132 (3.35)

-T-

SEATING

PLANE

.100 (2.54) BSC

⊕D S .004 (.10)

.375 (9.53)

.385 (9.78)

DIP-8B

.057 (1.45)

.063 (1.60)

(NOTE 6)

0.15 (.38)

MINIMUM

Notes:

1. Package dimensions conform to JEDEC specification

MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)

package with .300 inch row spacing.

2. Controlling dimensions are inches. Millimeter sizes are

shown in parentheses.

3. Dimensions shown do not include mold flash or other

protrusions. Mold flash or protrusions shall not exceed

.006 (.15) on any side.

4. Pin locations start with Pin 1, and continue counter-clock-

wise to Pin 8 when viewed from the top. The notch and/or

dimple are aids in locating Pin 1. Pin 6 is omitted.

5. Minimum metal to metal spacing at the package body for

the omitted lead location is .137 inch (3.48 mm).

6. Lead width measured at package body.

7. Lead spacing measured with the leads constrained to be

perpendicular to plane T.

.125 (3.18)

.135 (3.43)

.048 (1.22)

.014 (.36)

.022 (.56)

.053 (1.35)

⊕T E D S .010 (.25) M

.010 (.25)

.015 (.38)

.300 (7.62) BSC

(NOTE 7)

.300 (7.62)

.390 (9.91)

P08B

PI-2551-033001

SMD-8B

-E-

.245 (6.22)

.255 (6.48)

Pin 1

-D-

.128 (3.25)

.132 (3.35)

⊕ D S .004 (.10)

.372 (9.45)

.388 (9.86)

⊕ E S .010 (.25)

.100 (2.54) (BSC)

.375 (9.53)

.385 (9.78)

.057 (1.45)

.063 (1.60)

(NOTE 5)

Heat Sink is 2 oz. Copper

As Big As Possible

Notes:

1. Controlling dimensions are

inches. Millimeter sizes are

shown in parentheses.

2. Dimensions shown do not

include mold flash or other

protrusions. Mold flash or

protrusions shall not exceed

.420 .006 (.15) on any side.

3. Pin locations start with Pin 1,

and continue counter-clock

.046 .060 .060 .046

Pin 8 when viewed from the

top. Pin 6 is omitted.

4. Minimum metal to metal

Pin 1

.080

spacing at the package body

for the omitted lead location

.086

.186

.286

is .137 inch (3.48 mm).

5. Lead width measured at

package body.

6. D and E are referenced

Solder Pad Dimensions

datums on the package

body.

.032 (.81)

.037 (.94)

.048 (1.22)

.053 (1.35)

.009 (.23)

.004 (.10)

.012 (.30)

.004 (.10)

.036 (0.91)

.044 (1.12)

0°- 8°

G08B

PI-2546-040501

35 B

7/01

Share Link: