DA9122.002
7 September, 2001
SOLDERING INFORMATION
Resistance to Soldering Heat
Maximum Reflow Temperature
Maximum Number of Reflow Cycles
Seating Plane Co-planarity
Lead Finish
According to RSH test IEC 68-2-58/20 2*220°C
235°C
2
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
EMBOSSED TAPE SPECIFICATIONS
E
WF
P1
P2
DO
PO
A
AO
D1
User Direction of Feed
T
BO
KO
Section A-A
Dimension
Ao
Bo
Do
D1
E
F
Ko
Po
P1
P2
T
W
Pin 1 Designator
Min/Max
5.00 ±0.10
3.20 ±0.10
1.50 +0.1/-0.0
1.50 min
1.75
5.50 ±0.05
1.45 ±0.10
4.0
8.0 ±0.10
2.0 ±0.05
0.3 ±0.05
12.00 +0.30/-0.10
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
10 (12)