HSDL-4200 データシートの表示（PDF） - HP => Agilent Technologies
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HSDL-4200 Datasheet PDF : 5 Pages
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The package design of these
emitters is optimized for efficient
power dissipation. Copper
leadframes are used to obtain
better thermal performance than
the traditional steel leadframes.
The wide angle emitter, HSDL-
4220, is compatible with the IrDA
SIR standard and can be used
with the HSDL-1000 integrated
SIR transceiver.
Absolute Maximum Ratings
Parameter
Peak Forward Current
Symbol
IFPK
Average Forward Current
DC Forward Current
Power Dissipation
Reverse Voltage (IR = 100 µA)
Transient Forward Current (10 µs Pulse)
Operating Temperature
Storage Temperature
LED Junction Temperature
Lead Soldering Temperature
[1.6 mm (0.063 in.) from body]
IFAVG
IFDC
PDISS
VR
IFTR
TO
TS
TJ
Min Max Unit
Reference
500
mA
[2], Fig. 2b
Duty Factor = 20%
Pulse Width = 100 µs
100
mA
[2]
100
mA
[1], Fig. 2a
260
mW
5
V
1.0
A
[3]
0
70
°C
-20
85
°C
110
°C
260 for °C
5 seconds
Notes:
1. Derate linearly as shown in Figure 4.
2. Any pulsed operation cannot exceed the Absolute Max Peak Forward Current as specified in Figure 5.
3. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and
the wire bonds.
Electrical Characteristics at 25°C
Parameter
Forward Voltage
Forward Voltage
Temperature Coefficient
Series Resistance
Diode Capacitance
Reverse Voltage
Thermal Resistance,
Junction to Pin
Symbol
VF
Min
1.30
1.40
∆V/∆T
RS
CO
VR
5
Rθjp
Typ
1.50
1.67
2.15
-2.1
-2.1
2.8
40
20
110
Max
1.70
1.85
Unit
V
mV/ °C
ohms
pF
V
°C/W
Condition
IFDC = 50 mA
IFDC = 100 mA
IFPK = 250 mA
IFDC = 50 mA
IFDC = 100 mA
IFDC = 100 mA
0 V, 1 MHz
IR = 100 µA
Reference
Fig. 2a
Fig. 2b
Fig. 2c
4-49
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