DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

BC859C データシートの表示(PDF) - Diotec Semiconductor Germany

部品番号
コンポーネント説明
メーカー
BC859C
Diotec
Diotec Semiconductor Germany  Diotec
BC859C Datasheet PDF : 2 Pages
1 2
BC 856 ... BC 860
General Purpose Transistors
PNP
Surface mount Si-Epitaxial PlanarTransistors
Si-Epitaxial PlanarTransistoren für die Oberflächenmontage
PNP
2.9 ±0.1
1.1
0.4
3
Type
Code
1
2
1.9
Dimensions / Maße in mm
1=B 2=E 3=C
Power dissipation – Verlustleistung
Plastic case
Kunststoffgehäuse
Weight approx. – Gewicht ca.
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
250 mW
SOT-23
(TO-236)
0.01 g
Maximum ratings (TA = 25/C)
Collector-Emitter-voltage
B open
Collector-Base-voltage
E open
Emitter-Base-voltage
C open
Power dissipation – Verlustleistung
Collector current – Kollektorstrom (DC)
Peak Collector current – Kollektor-Spitzenstrom
Peak Base current – Basis-Spitzenstrom
Peak Emitter current – Emitter-Spitzenstrom
Junction temperature – Sperrschichttemperatur
Storage temperature – Lagerungstemperatur
- VCE0
- VCB0
- VEB0
Ptot
- IC
- ICM
- IBM
IEM
Tj
TS
BC 856
65 V
80 V
Grenzwerte (TA = 25/C)
BC 857/860 BC 858/859
45 V
30 V
50 V
30 V
5V
250 mW 1)
100 mA
200 mA
200 mA
200 mA
150/C
- 65…+ 150/C
Characteristics (Tj = 25/C)
DC current gain – Kollektor-Basis-Stromverhältnis 2)
- VCE = 5 V, - IC = 10 :A
hFE
- VCE = 5 V, - IC = 2 mA
hFE
h-Parameters at - VCE = 5V, - IC = 2 mA, f = 1 kHz
Small signal current gain
Kleinsignal-Stromverstärkung
hfe
Input impedance – Eingangs-Impedanz
hie
Output admittance – Ausgangs-Leitwert
hoe
Reverse voltage transfer ratio
Spannungsrückwirkung
hre
Group A
typ. 90
110...220
Kennwerte (Tj = 25/C)
Group B
Group C
typ. 150
200...450
typ. 270
420...800
typ. 220
1.6...4.5 kS
18 < 30 :S
typ.1.5 *10-4
typ. 330
3.2...8.5 kS
30 < 60 :S
typ. 2 *10-4
typ. 600
6...15 kS
60 < 110 :S
typ. 3 *10-4
1) Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluß
2) Tested with pulses tp = 300 :s, duty cycle # 2% – Gemessen mit Impulsen tp = 300 :s, Schaltverhältnis # 2%
14
01.11.2003

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]