MAX15027ATBT データシートの表示（PDF） - Maxim Integrated

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MAX15027ATBT

1.425V to 3.6V Input, 1A Low-Dropout Regulators with BIAS Input

Maxim Integrated 

MAX15027/MAX15028

1.425V to 3.6V Input, 1A Low-Dropout

Regulators with BIAS Input

Absolute Maximum Ratings

IN, FB, SS, I.C. to GND........................................-0.3V to +4.0V

BIAS to GND............................................................-0.3V to +6V

EN to GND.............-0.3V to the lower of (VBIAS + 0.3V) or +6V

OUT to GND............................................... -0.3V to (VIN + 0.3V)

Output Short-Circuit Duration.....................................Continuous

Continuous Power Dissipation (TA = +70°C)

10-Pin TDFN, Multilayer Board

(derate 24.4mW/°C above +70°C).............................1951mW

Operating Junction Temperature Range........... -40°C to +125°C

Maximum Junction Temperature......................................+150°C

Storage Temperature Range............................. -65°C to +150°C

Lead Temperature (soldering, 10s).................................. +300°C

Soldering Temperature (reflow)........................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics (Note 1)

Junction-to-Ambient Thermal Resistance (θJA)................ 41°C/W

Junction-to-Case Thermal Resistance (θJC).....................9°C/W

Chip Information

PROCESS: BiCMOS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Package Information

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

PACKAGE TYPE

PACKAGE CODE

OUTLINE NO.

LAND PATTERN NO.

10 TDFN-EP

T1033+1

21-0137

90-0003

Electrical Characteristics

(Circuit of Figure 1; VIN = 1.8V, VOUT = 1.2V, EN = IN for MAX15027, EN = BIAS for MAX15028, IOUT = 100mA, TA = TJ = -40°C to

+125°C. Typical values are at TA = +25°C, unless otherwise noted.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

IN

MAX15027

1.425

3.600

Input Voltage Range

VIN

MAX15028

VBIAS = 3V to 5.5V

BIAS = IN

1.425

3.000

3.600

V

3.600

Undervoltage Lockout

VUVLO

VIN rising,

IOUT = 2mA

MAX15027

MAX15028

1.275 1.325 1.375

V

1.04 1.106 1.14

Undervoltage Lockout Hysteresis VUVLO_HYST

50

mV

Quiescent GND Current

VIN = 1.425V to 3.6V, VOUT = 1.2V,

IOUT = 1mA, VBIAS = 3.3V

160

275

410

IGND

VIN = 3.6V, VOUT = 3.3V, IOUT = 100mA

180

275

560

µA

VIN = 3.3V, VOUT = 3.3V, IOUT = 500mA

170

315

470

Input Supply Current in Shutdown

IIN_SD

VEN = 0V, TA = -40°C to +85°C

0.1

5.5

µA

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