SATA I/SATA II Bidirectional Re-Driver
Functional Diagram/Truth Table
VCC
VCC MAX4951 VCC
50Ω
50Ω 50Ω
50Ω
HAP
HAM
VCC
DAP
DAM
VCC
50Ω
HBM
HBP
50Ω 50Ω
CONTROL LOGIC
GND
BA BB EN
50Ω
DBM
DBP
EN BA BB
0XX
100
110
101
111
X = Don’t Care
MAX4951
CHANNEL A
Standby
Standard SATA
Boost
Standard SATA
Boost
CHANNEL B
Standby
Standard SATA
Standard SATA
Boost
Boost
Exposed-Pad Package
The exposed-pad, 20-pin, TQFN package incorporates
features that provide a very low thermal-resistance path
for heat removal from the IC. The exposed pad on the
MAX4951 must be soldered to GND for proper thermal
and electrical performance. For more information on
exposed-pad packages, refer to Maxim Application
Note HFAN-08.1: Thermal Considerations of QFN and
Other Exposed-Paddle Packages.
Layout
Use controlled-impedance transmission lines to inter-
face with the MAX4951 high-speed inputs and outputs.
Place power-supply decoupling capacitors as close as
possible to VCC.
ESD Protection
As with all Maxim devices, ESD-protection structures
are incorporated on all pins to protect against electro-
static discharges encountered during handling and
assembly. The MAX4951 is protected against ESD up
to ±5.5kV (Human Body Model) without damage. The
ESD structures withstand ±5.5kV in all states: normal
operation and powered down. After an ESD event, the
MAX4951 continues to function without latchup.
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