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25Q80DVAIG データシートの表示(PDF) - Winbond

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25Q80DVAIG Datasheet PDF : 71 Pages
First Prev 71
W25Q80DV
11. REVISION HISTORY
VERSION
A
B
DATE
2013/10/24
2013/12/13
C
2014/05/22
D
2014/07/29
E
2014/12/16
F
2015/02/11
G
2015/07/21
PAGE
All
All
5-7,68-69
63
5-7,65-68
5-8,68-70
68
62
DESCRIPTION
New Create Preliminary
Removed Preliminary
Updated VSOP-150mil
Removed unaviable package information
Updated USON 2x3mm
Updated WLCSP package information
Updated WLCSP POD
Updated SOIC8 150-mil POD
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in
systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control
instruments, or for other applications intended to support or sustain life. Further more, Winbond products
are not intended for applications wherein failure of Winbond products could result or lead to a situation
wherein personal injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
- 71 -
Publication Release Date:July 21, 2015
Prelimry-Revision G

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