TC7660SVOA723 データシートの表示（PDF） - Microchip Technology

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TC7660SVOA723

Super Charge Pump DC-to-DC Voltage Converter

Microchip Technology 

TC7660S

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1RWH For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

DATUM A

ALTERNATE LEAD DESIGN

(VENDOR DEPENDENT)

DATUM A

b

e

2

e

b

e

2

e

Units

Dimension Limits MIN

Number of Pins

N

Pitch

e

Top to Seating Plane

A

-

Molded Package Thickness

A2

.115

Base to Seating Plane

A1

.015

Shoulder to Shoulder Width

E

.290

Molded Package Width

E1

.240

Overall Length

D

.348

Tip to Seating Plane

L

.115

Lead Thickness

c

.008

Upper Lead Width

b1

.040

Lower Lead Width

b

.014

Overall Row Spacing

§

eB

-

INCHES

NOM

8

.100 BSC

-

.130

-

.310

.250

.365

.130

.010

.060

.018

-

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

MAX

.210

.195

-

.325

.280

.400

.150

.015

.070

.022

.430

Microchip Technology Drawing No. C04-018D Sheet 2 of 2

DS20001467C-page 14

 2001-2015 Microchip Technology Inc.

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