42568WP データシートの表示（PDF） - STMicroelectronics

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コンポーネント説明

メーカー

42568WP

256 Kbit Serial I2C Bus EEPROM / 4256BWP / SOP8

STMicroelectronics 

Package mechanical data

M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF

Figure 17. UFDFPN8 (MLP8) – package outline (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

$

EB

,

,

%

0IN

%

+

,

!

$

EEE

!

:7?-%E6

1. Drawing is not to scale.

2.

The central pad (area E2 by D2 in

connected to any other voltage or

the above

signal line

oillnusthtreatPioCnB) ,isfoinr teexrnaamllpylepudlulerdingtothVeSSs.oIltdmeruinsgt

not be

process.

Table 20. UFDFPN8 (MLP8) – package dimensions (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

Symbol

millimeters

Typ

Min

Max

inches(1)

Typ

Min

Max

A

0.550

0.450

0.600

0.0217

0.0177

0.0236

A1

0.020

0.000

0.050

0.0008

0.0000

0.0020

b

0.250

0.200

0.300

0.0098

0.0079

0.0118

D

2.000

1.900

2.100

0.0787

0.0748

0.0827

D2 (rev MC)

–

1.200

1.600

–

0.0472

0.0630

E

3.000

2.900

3.100

0.1181

0.1142

0.1220

E2 (rev MC)

–

1.200

1.600

–

0.0472

0.0630

e

0.500

–

–

0.0197

–

–

K (rev MC)

–

0.300

–

–

0.0118

–

L

–

0.300

0.500

–

0.0118

0.0197

L1

–

–

0.150

–

–

0.0059

L3

–

0.300

–

eee(2)

–

0.080

–

–

0.0118

–

–

0.0031

–

1. Values in inches are converted from mm and rounded to four decimal digits.

2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

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DocID6757 Rev 32

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