NLAST44599DTR2G データシートの表示（PDF） - ON Semiconductor
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NLAST44599DTR2G Datasheet PDF : 12 Pages
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NLAST44599
MAXIMUM RATINGS
Symbol
Parameter
VCC
Positive DC Supply Voltage
VIS
Analog Input Voltage (VNO or VCOM)
VIN
Digital Select Input Voltage
IIK
DC Current, Into or Out of Any Pin
PD
Power Dissipation in Still Air
QFN−16
TSSOP−16
TSTG
TL
TJ
MSL
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Moisture Sensitivity
FR
VESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 30% − 35%
Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
ILATCH−UP Latch−Up Performance
qJA
Thermal Resistance
Above VCC and Below GND at 125°C (Note 4)
QFN−16
TSSOP−16
Value
*0.5 to )7.0
*0.5 ≤ VIS ≤ VCC )0.5
*0.5 ≤ VI ≤ )7.0
$50
800
450
*65 to )150
260
+150
Level 1
UL−94−VO (0.125 in)
2000
200
1000
$300
80
164
Unit
V
V
V
mA
mW
°C
°C
°C
V
mA
°C/W
Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Extended exposure to these conditions
or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute−maximum−rated conditions is
not implied. Functional operation should be restricted to the Recommended Operating Conditions.
1. Tested to EIA/JESD22−A114−A.
2. Tested to EIA/JESD22−A115−A.
3. Tested to JESD22−C101−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
DC Supply Voltage
VIN
Digital Select Input Voltage
VIS
Analog Input Voltage (NC, NO, COM)
TA
Operating Temperature Range
tr, tf
Input Rise or Fall Time, SELECT
VCC = 3.3 V $ 0.3 V
VCC = 5.0 V $ 0.5 V
Min
2.0
GND
GND
*55
0
0
Max
5.5
5.5
VCC
)125
100
20
Unit
V
V
V
°C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
http://onsemi.com
3
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