Q67060-S6307-A7 データシートの表示（PDF） - Infineon Technologies
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Q67060-S6307-A7 Datasheet PDF : 15 Pages
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Thermal Characteristics
Parameter and Conditions
Symbol
Thermal resistance
chip - case: RthJC
junction - ambient (free air): RthJA
SMD version, device on PCB4):
BTS 640 S2
Values
Unit
min typ max
--
-- 1.47 K/W
--
-- 75
-- 33
--
Electrical Characteristics
Parameter and Conditions
at Tj = 25 °C, Vbb = 12 V unless otherwise specified
Symbol
Values
Unit
min typ max
Load Switching Capabilities and Characteristics
On-state resistance (pin 4 to 6&7)
IL = 5 A
Tj=25 °C: RON
Tj=150 °C:
Output voltage drop limitation at small load
currents (pin 4 to 6&7), see page 14
IL = 0.5 A
Tj =-40...+150°C:
Nominal load current, ISO Norm (pin 4 to 6&7)
VON = 0.5 V, TC = 85 °C
Nominal load current, device on PCB4)
TA = 85 °C, Tj ≤ 150 °C VON ≤ 0.5 V,
Output current (pin 6&7) while GND disconnected
or GND pulled up, Vbb=30 V, VIN= 0, see diagram page
9; not subject to production test, specified by design
Turn-on time
IN
to 90% VOUT:
Turn-off time
IN
to 10% VOUT:
RL = 12 Ω, Tj =-40...+150°C
Slew rate on
10 to 30% VOUT, RL = 12 Ω, Tj =-40...+150°C
Slew rate off
70 to 40% VOUT, RL = 12 Ω, Tj =-40...+150°C
VON(NL)
IL(ISO)
IL(NOM)
IL(GNDhigh)
ton
toff
dV /dton
-dV/dtoff
-- 27
54
-- 50
11.4 12.6
4.0 4.5
--
--
25 70
25 80
0.1
--
0.1
--
30 mΩ
60
-- mV
-- A
-- A
8 mA
150 µs
200
1 V/µs
1 V/µs
4) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for Vbb
connection. PCB is vertical without blown air.
Semiconductor Group
Page 3
2003-Oct-01
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